Weideng Electronics Delivers High-Precision, Fully Automated Etching Line, Enabling Production Accuracy to Surpass ±0.02nm

Ltd. (hereinafter referred to as "Weideng Electronics") officially delivered a high-precision automatic etching production line in June 2024 to a research institute under China Aviation Industry Corporation (AVIC). The production line will be used in the manufacture of turbine blades for new generation warplanes, solving the problem of micro-hole processing of high temperature alloys.

The core of the production line is equipped with Weideng's self-developed multi-axis linkage precision etching chamber, through the submicron spray pressure control system and visual compensation algorithms, so that the etching tolerance is stably controlled within the range of ± 0.02nm, compared with the traditional equipment to improve the accuracy of 300%. Meanwhile, the integrated waste gas and waste water zero discharge module: acidic waste gas purified by two-stage lye spray + activated carbon adsorption, the emission concentration is less than 1mg/m³; nickel-containing wastewater through the membrane separation and electrolysis recycling technology to achieve a heavy metal recovery rate of 99%, the reuse rate of water resources is more than 90%, which is fully in line with the requirements of the GB31573-2015 "Inorganic Chemical Industry Pollutant Emission Standards" special limit value.

"The production line realises seamless collaboration between the etching process and six-axis robots for the first time," said Widener's technical director at the acceptance site, "The robotic arm automatically grabs workpieces and matches 3D laser scanning and positioning, which improves the processing efficiency of complex curved parts by 50% and reduces manual intervention by 80%. " It is estimated that the production line can save 2 million yuan in hazardous waste treatment costs and reduce wastewater discharge by 15,000 tonnes per year.

The cooperation lasted 18 months, Weideng team overcame the high temperature alloy stress crack control, microporous depth to width ratio of 1:20 and other problems, and was awarded two utility model patents. The project marks the domestic high-end etching equipment formally entered the core supply chain of aviation manufacturing, laying the technical foundation for the subsequent aerospace engine, semiconductor lithography mask plate and other projects.