| Parametric | Standard Scope | Note |
|---|---|---|
| Processing thickness | 0.05-2.0mm | Ultra-thin materials require special tension control |
| Etching accuracy | ±0.01-0.05mm | Positive correlation with mask accuracy |
| Minimum Hole Diameter | ≥ 80% of board thickness | Avoid fluid flow blockage |
| Etching rate | 1-20μm/min(depending on the material) | 316L stainless steel rates are lower than 304 |
| Surface roughness | Ra 0.8-3.2μm | Can be improved by electrolytic polishing |
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