en
| module (in software) | Key technologies | Performance indicators |
|---|---|---|
| Multi-functional wet etching tank | Four tanks in one design (etching/cleaning/degumming/passivation), PTFE anti-corrosion material | Temperature control: ± 0.5 ℃ (RT-80 ℃), support nitrogen bubbles |
| Plasma Dry Etcher | ICP-RIE (inductively coupled plasma) or RIE mode with auto matcher | Vacuum: ≤5×10-⁵Pa, etching uniformity: ±3% (4-inch sheet) |
| Microzone Graphical System | Laser direct writing (405nm) or vacuum contact exposure with nano-alignment | Resolution: 0.5μm (photolithography)/2μm (laser), registration accuracy: ±0.25μm |
| In situ monitoring unit | Optical Interferometry + Raman Spectroscopy | Real-time thickness monitoring accuracy: ±1nm, composition analysis sensitivity: 0.1at% |
| Exhaust gas treatment system | Three-stage treatment (low-temperature condensation + activated carbon adsorption + catalytic decomposition) | HF/HCl removal rate >99.9%, in accordance with NFPA 45 standard |
| Intelligent Control Platform | IoT integration, process recipe cloud storage | Supports Python script control with a data traceability cycle of >5 years |
