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| Parametric | Industry leader | Application Impact |
|---|---|---|
| Minimum opening size | 15μm (round hole)/25μm (square hole) | Supports 01005 component pad printing |
| Hole position accuracy | ±5μm@300mm板幅 | Elimination of QFN device bridging defects |
| Thickness Range | 0.08-0.2mm | Ultra-thin boards (0.1mm) for Mini LEDs |
| Etching Taper | 0°±0.5°（tunable） | Impact on solder paste release rate (>90% of target) |
| Tension control accuracy | ±0.2N | Prevents folding and deformation of ultra-thin stencils |
