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Copper foil thinning etching machine

Copper Foil Thinning Etching Machine is a precision equipment specially designed for high-precision thickness thinning and graphic processing of electrolytic copper foil or calendered copper foil, which is mainly used in the fields of high-density interconnection (HDI) circuit boards, IC carrier boards, flexible electronics, and Li-ion battery collectors.
  • Detailed Description

Main technical parameters

Parametric Standard Scope Note
Applicable copper foil thickness 0.006-0.07mm <8μm need to be equipped with a low-tension suspension transfer system.
Thinning accuracy ±0.3-0.8μm Thickness detection resolution 0.1μm
Etching rate 1-5μm/min(two-sided) Rate positively correlated with temperature (+7% per 1°C increase in rate)
Minimum Line Width 15μm(thinned) Calendered copper foils are superior to electrolytic copper foils due to the crystalline orientation of the copper foils
Copper recovery rate ≥99% Recovery of copper sponge through electrolytic regeneration systems

 

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